The geeks are jointed by Intel to discuss PCI Express technology and the new BTX form factor. Join Jim Pappas, director of technology initiatives for Intel, and Craig Randleman, Balanced Technology Extended (BTX) program manager for Intel, and the geeks to learn more about these next-generation PC technologies.
The geeks are jointed by Intel to discuss PCI Express technology and the new BTX form factor. Join Jim Pappas, director of technology initiatives for Intel, and Craig Randleman, Balanced Technology Extended (BTX) program manager for Intel, and the geeks to learn more about these next-generation PC technologies.
PCI Express technology is the successor to today’s PCI bus and AGP graphic architectures. The serial PCI Express architecture offers scalable bandwidth from 2.5 to 80 Gigabits per second and advanced features that meet the I/O needs of next-generation systems like 10 GHz-plus CPU speeds, faster memory, higher-speed graphics, and support for highspeed GigaBit Ethernet networking. With the demands of emerging computing models exceeding the capabilities of the traditional PCI bus, there is a need for much greater internal system bandwidth for the next decade. PCI Express was designed to meet the requirements of the growing number of high-bandwidth applications, such as high-quality digital photography, multimedia, advanced computer-aided design and digital video editing. The image to the left shows two PCI Express connectors (the dark connectors) next to two PCI connectors (the light connectors) that are used on motherboards today.
BTX (Balanced Technology Extended) is a new form factor that is enabling the next generation in PC system design and enables the industry to better address thermal management issues (including the heat generated by high-speed processors), system size and shape, and acoustics — all critical attributes to innovate desktop PCs for the digital home and office.BTX design benefits are much improved over the current ATX form factor. BTX places high-power components in-line, allowing them to be cooled with the same high velocity, low temperature airflow that travels from the front of the system to the rear panel. It is also designed to offer lower airflow impedance, allowing for reduced total fan count, lower fan speeds and, as a result, lower acoustic envelopes
